SEMICONDUCTOR DEVICE WITH FIN STRUCTURES

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United States of America

APP PUB NO 20240363419A1
SERIAL NO

18767168

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Abstract

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A semiconductor device structure is provided. The semiconductor device structure includes a substrate and a first fin structure, a second fin structure, and a third fin structure over the substrate. Tops of the second fin structure and the third fin structure are at different height levels. The semiconductor device structure also includes a first epitaxial structure extending across sidewalls of the first fin structure and the second fin structure and a second epitaxial structure on the third fin structure. The first epitaxial structure is closer to the substrate than the second epitaxial structure.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTDHSINCHU

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KENG, Wen-Chun Hsinchu County, TW 23 28
LIN, Yu-Kuan Taipei City, TW 95 558
WANG, Ping-Wei Hsin-chu, TW 186 1402
YANG, Chang-Ta Hsinchu City, TW 44 622

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