THINNER COMPOSITION, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICES USING SAID THINNER COMPOSITION
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United States of America
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Oct 31, 2024
app pub date -
Jul 25, 2022
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Jul 25, 2022
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Abstract
A thinner composition includes: (B) a solvent containing: (B1) a compound represented by the following general formula (b-1): wherein R1 is an alkyl group having 1 to 10 carbon atoms. A method for manufacturing a semiconductor device includes applying the thinner composition to a substrate, before applying a photoresist film material or a photoresist underlayer film material to the substrate.
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