METHOD AND SYSTEM FOR REGENERATING ELECTROLYTIC COPPER PLATING SOLUTION
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United States of America
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Oct 31, 2024
app pub date -
Apr 24, 2024
filing date -
Apr 24, 2024
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Abstract
A method for regenerating an electrolytic copper plating solution containing a copper ion and at least one additive selected from the group consisting of a brightener, a carrier, and a leveler at least includes: ultraviolet-ozone treatment of oxidizing the electrolytic copper plating solution to decompose an organic impurity in the electrolytic copper plating solution; and activated carbon treatment of bringing activated carbon into contact with the electrolytic copper plating solution which has been subjected to the ultraviolet-ozone treatment to remove the organic impurity in the electrolytic copper plating solution.
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