HEATING MODULE AND PROGRAM CONTROL METHOD FOR PUMPING LINE OF SEMICONDUCTOR PROCESSING TOOL
Number of patents in Portfolio can not be more than 2000
United States of America
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Issued Date -
Oct 31, 2024
app pub date -
Apr 28, 2023
filing date -
Apr 28, 2023
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Abstract
A semiconductor processing tool includes: a process chamber into which a semiconductor wafer is loaded; a support for securing the wafer loaded into the chamber tool; an inlet which introduces a first gas into the chamber for processing the wafer; and an exhaust system that exhausts gas from the chamber. The exhaust system includes: a first line coupled to the chamber to exhaust gas from the chamber; and a pump to draw gas through the first line from the chamber. The tool further includes a heating module having: a second line coupled to the first and a supply of a second gas, the second gas being flowed through the second line from the supply into the first line; and a heating element contained in the second line, the heating element heating the second gas in the second line before the second gas is flowed into the first line.
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