RESIN COMPOSITION, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
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United States of America
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Issued Date -
Oct 31, 2024
app pub date -
Sep 15, 2022
filing date -
Sep 15, 2022
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Abstract
Provided are a resin composition for a semiconductor device of a wafer level chip size package type, which exhibits excellent high-frequency properties, and can form a coating film which has a thickness that has less unevenness, and is unlikely to cause warpage of the semiconductor substrate, a semiconductor device using the same, and a method for producing a semiconductor device. A resin composition for a semiconductor device of a wafer level chip size package type, the resin composition comprising (A) a modified polyphenylene ether resin having an unsaturated double bond at the end thereof, (B) an elastomer having a butadiene skeleton, and optionally (C) a solvent, a semiconductor device using the same, and a method for producing a semiconductor device.
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