SUBSTRATE STRUCTURE AND CUTTING METHOD THEREOF
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United States of America Patent
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Issued Date -
Oct 24, 2024
app pub date -
May 15, 2023
filing date -
May 15, 2023
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Abstract
A substrate structure and a cutting method thereof are provided. The cutting method includes the following steps. A first substrate structure is provided, wherein the first substrate structure includes a glass substrate and a redistribution layer disposed on the glass substrate. A laser process is performed on the glass substrate to form a modified region on the glass substrate. A wet etching process is performed on the modified region of the glass substrate to remove the modified region and form a plurality of second substrate structures.
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