OPTOELECTRONIC COMPONENT, LIGHTING UNIT AND METHOD OF MANUFACTURING AN OPTOELECTRONIC COMPONENT
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United States of America Patent
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Issued Date -
Oct 24, 2024
app pub date -
Sep 1, 2022
filing date -
Sep 1, 2022
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Abstract
In an embodiment an optoelectronic component includes a lead frame with a plurality of contacts, a circuit chip having a driver circuit, a bottom side facing the lead frame and a top side facing away from the lead frame, at least one radiation-emitting semiconductor chip arranged on the top side of the circuit chip, a redistribution layer arranged between the circuit chip and the radiation-emitting semiconductor chip for electrically contacting the driver circuit and the radiation-emitting semiconductor chip, and a housing body fastened to the lead frame, the housing body enclosing the circuit chip and having at least one recess above the circuit chip, in which the at least one radiation-emitting semiconductor chip is arranged, wherein terminals of the radiation-emitting semiconductor chip are electrically connected to the redistribution layer via bumps, and wherein the redistribution layer is electrically connected to the contacts of the lead frame via wire bonds.
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