SEMICONDUCTOR STRUCTURE
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United States of America Patent
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Issued Date -
Oct 24, 2024
app pub date -
Aug 17, 2023
filing date -
Aug 17, 2023
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Abstract
A semiconductor structure includes a circuit with a redistribution layer (RDL) formed over the circuit. The redistribution layer comprises a plurality of metal layers. An inductor is formed in a topmost metal layer, and the circuit is located directly under the inductor. An under bump metallization (UBM) layer formed on the topmost metal layer and a conductive connector formed on the UBM layer.
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