CONNECT STRUCTURE FOR SEMICONDUCTOR PROCESSING EQUIPMENT
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United States of America Patent
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Oct 24, 2024
app pub date -
Jun 28, 2024
filing date -
Jun 28, 2024
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Abstract
A connect structure for semiconductor processing equipment includes a housing configured to mate a deformable pipe with a non-deformable pipe. The housing includes a first annular sidewall to receive the deformable pipe and a second annular sidewall defining a first thread structure. An annular bead is connected to the first annular sidewall to flexibly deform the deformable pipe toward the non-deformable pipe structure when the first thread structure rotatably engages a second thread structure of the non-deformable pipe.
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