MULTILAYER ELECTRONIC COMPONENT
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United States of America Patent
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Issued Date -
Oct 24, 2024
app pub date -
Apr 1, 2024
filing date -
Apr 1, 2024
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Abstract
A multilayer electronic component includes a body including a dielectric layer including Ba and Ti and an internal electrode disposed alternately with the dielectric layer; and an external electrode disposed on the body, wherein the dielectric layer further includes Li and F, and wherein a content of Li included in the dielectric layer is 0.02 mole or more and 0.36 mole or less based on 100 moles of Ba included in the dielectric layer.
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