MULTILAYER CONDUCTOR, METHODS FOR THE MANUFACTURE THEREOF, AND ASSEMBLY COMPRISING THE MULTILAYER CONDUCTOR
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United States of America Patent
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Issued Date -
Oct 24, 2024
app pub date -
Apr 22, 2024
filing date -
Apr 22, 2024
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Abstract
A multilayer conductor includes a conductor layer and a dielectric layer on the conductor layer. The dielectric layer includes a polymer composition having a dissipation factor (Df) of less than 0.001 and includes a cyclic olefin copolymer, a transoctenamer rubber, syndiotactic polystyrene, a polymethylpentene olefin copolymer, or a combination thereof. The materials described herein can advantageously provide an improved adhesive strength between the conductor and the dielectric layer. Methods for the manufacture of the multilayer conductor are also described. The multilayer conductor can be useful in the preparation of magnetic self-resonant structures.
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