DEVICES AND METHODS FOR ANALYSIS OF MECHANICAL AND THERMAL LOADING OF STRUCTURES, AND METHODS FOR IMPROVING DESIGN PROCESSES FOR COMPONENTS OF SUCH STRUCTURES
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United States of America Patent
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Issued Date -
Oct 24, 2024
app pub date -
Apr 19, 2023
filing date -
Apr 19, 2023
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Abstract
A device for analysis of mechanical and thermal loading of structures can include: a first member comprising first material; a second member comprising second material; and a third member comprising the first material. The second member can be fastened at least partially between the first and third members. The device can be configured to mechanically load the first, second, and third members by applying equal and opposite force to protruding ends of the first, second, and third members. A device for analysis of mechanical and thermal loading of structures can include: a first member comprising first material; and a second member comprising second material. The first member can be fastened at least partially between portions of the second member. The device can be configured to mechanically load the first and second members by applying equal and opposite force to protruding ends of the first and second members.
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