AN ATOMIC LAYER DEPOSITION APPARATUS AND METHOD
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United States of America Patent
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Issued Date -
Oct 24, 2024
app pub date -
Aug 12, 2022
filing date -
Aug 12, 2022
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Abstract
An atomic layer deposition apparatus arranged to process multiple substrates concurrently in a batch process and a method for loading a substrate batch. The apparatus includes a loading chamber connected to the vacuum chamber through a loading connection; a loading arrangement arranged to move a substrate batch (B) between the loading chamber and the reaction chamber inside the vacuum chamber through the loading connection; and the reaction chamber including a support part forming a reactor bottom; and a cover part forming reactor side walls and a reactor roof. The cover part is movably arranged with respect to the support part between an open position of the reaction chamber and a closed position of the reaction chamber.
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