METHOD FOR PREPARING ORGANIC/INORGANIC HYBRID HIGH THERMALLY CONDUCTIVE AND INSULATING TWO-COMPONENT ADHESIVE AND METHOD FOR USING THE SAME
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United States of America Patent
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N/A
Issued Date -
Oct 24, 2024
app pub date -
Apr 19, 2024
filing date -
Apr 19, 2024
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
Provided are a method for preparing an organic/inorganic hybrid thermally conductive and insulating two-component adhesive and a method for using the same. The purpose is to solve the problem that thermally conductive adhesives in the prior art cannot meet the requirements of thermal conductivity, good bonding performance and insulation characteristics at the same time. The method includes: 1. preparing an organic phase aluminum dihydrogen phosphate; 2. treating a diamond thermally conductive filler; 3. modifying polyurethane compatible with aluminum dihydrogen phosphate; and 4. preparing an organic/inorganic hybrid insulating two-component adhesive. The use method includes: coating the adhesive onto a surface of a material to be bonded, and bonding; and subjecting a resulting member to be bonded to defoaming, heating, and holding.
First Claim
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