PRINTING COMPONENTS TO SUBSTRATE POSTS
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United States of America Patent
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Issued Date -
Oct 17, 2024
app pub date -
Feb 22, 2024
filing date -
Feb 22, 2024
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Abstract
A method of printing comprises providing a component source wafer comprising components, a transfer device, and a patterned substrate. The patterned substrate comprises substrate posts that extend from a surface of the patterned substrate. Components are picked up from the component source wafer by adhering the components to the transfer device. One or more of the picked-up components are printed to the patterned substrate by disposing each of the one or more picked-up components onto one of the substrate posts, thereby providing one or more printed components in a printed structure.
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