ELECTRONIC DEVICE PACKAGE AND FABRICATING METHOD THEREOF
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United States of America Patent
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Issued Date -
Oct 17, 2024
app pub date -
Apr 12, 2024
filing date -
Apr 12, 2024
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Abstract
Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 μm or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.
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