STACKED DIE NETWORK INTERFACE CONTROLLER CIRCUITRY

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United States of America Patent

APP PUB NO 20240347514A1
SERIAL NO

18757034

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A smart network interface controller (NIC) implemented using a stacked die configuration is provided. The NIC may include user-customizable networking circuits formed in a top programmable die and primitive network function blocks formed in a bottom application-specific integrated circuit (ASIC) die. The top programmable die may provide a flexible packet processing pipeline to facilitate efficient control and data communication between the user-customizable networking circuits and the primitive network function blocks. The bottom ASIC die may also include an array of memory blocks operable as lookup tables and intermediate buffers for other network processing circuitry in the NIC. A NIC configured in this way provides both performance, power, and area benefits and superior customer configurability.

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Patent Owner(s)

Patent OwnerAddress
INTEL CORP2200 MISSION COLLEGE BOULEVARD SANTA CLARA CALIFORNIA 95052 95052

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cheerla, Rakesh Cupertino, US 2 51
Dasu, Aravind Milpitas, US 25 239
Home, Martin Alamo, US 1 0
Ravipalli, Sreedhar Cupertino, US 13 66
Zaman, Naveed Saratoga, US 9 94

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