INTEGRATED-CIRCUIT MODULE COLLECTION AND DEPOSITION
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United States of America Patent
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Issued Date -
Oct 17, 2024
app pub date -
Aug 9, 2021
filing date -
Aug 9, 2021
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Abstract
A module collection and deposition system comprises a container, a module source wafer comprising modules released from the module source wafer, a module collection device operable to remove the modules from the module source wafer and dispose the modules as a disordered and dry collection into the container, and a module deposition device for removing the modules from the container and randomly disposing the modules on a receiving surface. Each module comprises an electronically active unpackaged component.
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