ELECTROSTATIC CHUCK, FOCUS RING, SUPPORT BASE, PLASMA PROCESSING APPARATUS, AND PLASMA PROCESSING METHOD
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United States of America Patent
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Issued Date -
Oct 17, 2024
app pub date -
Jun 24, 2024
filing date -
Jun 24, 2024
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Abstract
An electrostatic chuck according to an exemplary embodiment includes a first region and a second region. The first region has a first upper surface. The first region is configured to hold a substrate disposed on the first upper surface. The second region has a second upper surface. The second region extends in a circumferential direction to surround the first region. The second region is configured to support a focus ring mounted on the second upper surface. The first upper surface and the second upper surface extend along a single flat surface. The first region and the second region provide a space therebetween to separate the first upper surface and the second upper surface from each other.
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