TEMPERATURE SENSOR AND TEMPERATURE SENSOR ASSEMBLY
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United States of America Patent
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Issued Date -
Oct 17, 2024
app pub date -
Mar 21, 2024
filing date -
Mar 21, 2024
priority date (Note) -
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status (Latency Note)
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Abstract
A temperature sensor is integrated to a case to form a busbar module. The temperature sensor includes an FPC, a chip thermistor mounted on the FPC via surface mounting, a metallic heat receiving component configured to come into contact with an upper surface of a battery cell, and an elastic element integrated to the heat receiving component with the FPC interposed between the elastic element and the heat receiving component. The elastic element serves for pressing the heat receiving component such that the heat receiving component comes into contact with the upper surface of the battery cell with an appropriate pressure, wherein the elastic element is formed with a rubber material. The elastic element has a cavity formed therein such that the elastic element is not in contact with a portion of the FPC having the chip thermistor mounted thereon.
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