TEMPERATURE SENSOR ASSEMBLY
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United States of America Patent
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Issued Date -
Oct 17, 2024
app pub date -
Mar 21, 2024
filing date -
Mar 21, 2024
priority date (Note) -
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Abstract
A temperature sensor includes an FPC, a surface-mounted chip thermistor on the FPC, a metallic heat receiving component for contact with a cell upper surface, and an elastic element integrated to the heat receiving component. The case includes a facing wall and standing walls and, the facing wall facing the cell upper surface, wherein the standing walls and extend from the facing wall toward a plate portion of the elastic element. The elastic element serves for pressing the heat receiving component such that the heat receiving component comes into contact with the upper surface of the battery cell with an appropriate pressure, wherein the elastic element is formed with a rubber material. The elastic element includes a press-fit lock portion press-fitted into a holding hole in the facing wall, a plate portion with the FPC interposed between the plate portion and the heat receiving component, and an intermediate portion.
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