POLYMER LATEX FOR DIP-MOLDING APPLICATIONS

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United States of America Patent

APP PUB NO 20240343851A1
SERIAL NO

18616251

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Abstract

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The present invention relates to a polymer latex for dip-molding applications obtainable by free-radical emulsion polymerization of a mixture of ethylenically unsaturated monomers comprising at least one conjugated diene and at least one ethylenically unsaturated nitrile compound in an aqueous medium in presence of seed latex particles having a glass transition temperature (mid point temperature Tmg) measured by DSC according to ASTM D3418-03 of −50° C. to 50° C. wherein the seed latex particles do not contain structural units derived from ethylenically unsaturated nitrile compounds, to a method of preparing said polymer latex, to articles made by using said polymer latex and to a method for preparing dip-molded articles from said polymer latex.

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Patent Owner(s)

Patent OwnerAddress
SYNTHOMER SDN BHDKLUANG JOHOR DARUL TAKZIM 86000

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Abele, Alexandra Dulmen, DE 6 14
Butz, Sören Dulmen, DE 4 1
Kells, Andrew Kuala Lumpur, MY 3 1
Saunders, Brian Sale, GB 38 240
Shaw, Peter L Bishop's Stortford, GB 2 0
Simpson, Gareth Sawston, GB 6 25

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