SELECTIVE STENCIL MASK AND A STENCIL PRINTING METHOD

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United States of America Patent

APP PUB NO 20240343055A1
SERIAL NO

18619148

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A selective stencil mask and a stencil printing method are provided. The stencil mask is for printing a fluid material onto a substrate, and comprises: a stencil member comprising: at least one printing region each having an array of apertures that allow the fluid material to flow therethrough and deposit onto the substrate; and a blocking region configured to prevent the fluid material from flowing therethrough; and a supporting member attached to the stencil member and configured to, when the stencil mask is placed on the substrate, contact the substrate and create a gap between the stencil member and the substrate.

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Patent Owner(s)

Patent OwnerAddress
STATS CHIPPAC PTE LTD5 YISHUN STREET 23 SINGAPORE 768442

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HEO, SeokBeom Incheon, KR 2 0
KIM, SeongKuk Gyeonggi-do, KR 6 0
KOO, KyoWang Incheon, KR 25 75
PARK, HyunSeok Gyeonggi-do, KR 7 15

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