DEVICE AND METHOD FOR PROCESSING A WORKPIECE
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United States of America Patent
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Issued Date -
Oct 17, 2024
app pub date -
May 31, 2024
filing date -
May 31, 2024
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Abstract
A device for processing a workpiece using a laser beam of a laser includes a retarder plate and a focusing device. The retarder plate is configured to apply a first location-dependent phase retardation to a first part of the laser beam having a first input polarization, and to apply a second location-dependent phase retardation to a second part of the laser beam having a second input polarization. The focusing device is configured to focus the laser beam in at least one focus zone. A beam form of the laser beam in the focus zone is determined by the first location-dependent phase retardation and the second location-dependent phase retardation. The at least one focus zone at least partially overlaps with the workpiece. The workpiece is subjected to laser radiation in the at least one focus zone and is thus processed.
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