Heatsink techniques for optical and electrical modules
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United States of America Patent
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Issued Date -
Oct 10, 2024
app pub date -
Jun 17, 2024
filing date -
Sep 16, 2019
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Abstract
A module for use in a hardware platform for networking, computing, and/or storage includes a printed circuit board assembly; components disposed on a primary side of the printed circuit board assembly; a primary side heatsink for a pluggable module, wherein the primary side heatsink is disposed to one or more pivot points on the pluggable module, for applying a uniform and controlled external force against the pluggable module. The module further includes a cage attached to the printed circuit board assembly for supporting the pluggable module, wherein the one or more pivot points are external to the cage.
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