CU-AG ALLOY WIRE AND METHOD FOR PRODUCING THE SAME
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United States of America Patent
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Issued Date -
Oct 10, 2024
app pub date -
May 24, 2023
filing date -
Jun 7, 2022
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Abstract
An object of the present invention is to provide a Cu—Ag alloy wire that has satisfactory hardness and specific resistance both suitable for probe pins. A Cu—Ag alloy wire that achieves the above object contains 0.1 to 30 mass % of Ag, with a remainder composed of Cu and unavoidable impurities. The Cu—Ag alloy wire has a Vickers hardness of 300 HV or more and a specific resistance of 3.0 μΩ·cm or less.
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