INTEGRATION OF ADVANCED PHOTONIC MATERIALS IN SILICON PHOTONIC PLATFORM
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United States of America Patent
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Issued Date -
Oct 10, 2024
app pub date -
Apr 7, 2023
filing date -
Apr 7, 2023
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Abstract
Embodiments herein describe a photonic platform having a chiplet with a Pockels effect electro-optic layer made of LN or BTO and a substrate. The chiplet is bonded to a photonic wafer which includes a waveguide. In this manner, a ridge waveguide formed by the Pockels effect electro-optic layer and the waveguide utilizes electro-optic effects to tune a signal.
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