HEAT PUMP SYSTEM

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20240337420A1
SERIAL NO

18745661

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Abstract

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A heat pump system includes a heat pump cycle, a heating unit, a low-temperature side heat medium circuit, and a control unit. The heat pump cycle includes a compressor, a condenser, and an evaporator. The heating unit heats ventilation air with heat released form refrigerant in the condenser. The low-temperature side heat medium circuit circulates a low-temperature side heat medium such that the refrigerant in the evaporator absorbs heat of the low-temperature side heat medium, and includes a heat source device and a heat amount adjustment unit. The control unit causes an amount of heat transfer in the heating unit for heating the ventilation air to approach a predetermined target value via adjustment in temperature of the low-temperature side heat medium by controlling a rotation speed of the compressor and an operation of at least one of the heat source device and the heat amount adjustment unit.

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Patent Owner(s)

Patent OwnerAddress
TOYOTA JIDOSHA KABUSHIKI KAISHA1 TOYOTA-CHO TOYOTA-SHI AICHI-KEN 471-8571
DENSO CORPORATION1-1 SHOWA-CHO KARIYA-SHI AICHI 4488661 ?4488661

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
AIKAWA, Hidefumi Sunto-gun, JP 32 161
ITO, Satoshi Kariya-city, JP 340 2662
KAKEHASHI, Nobuharu Kariya-city, JP 69 1308
KATO, Naoki Kariya-city, JP 180 2009
MATSUMOTO, Tatsuhito Kariya-city, JP 7 62
MICHIKAWAUCHI, Ryo Numazu-shi, JP 25 100
NUMATA, Masanari Kariya-city, JP 4 0
OFUNE, Yu Kariya-city, JP 13 12
OHTSUKA, Kaoru Mishima-shi, JP 25 256
OI, Yasuhiro Susono-shi, JP 23 204

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