MULTIFUNCTIONAL SINTERING OR DIFFUSION SOLDERING DEVICE AND PRESSING TOOL
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United States of America
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N/A
Issued Date -
Oct 10, 2024
app pub date -
Oct 7, 2022
filing date -
Oct 7, 2022
priority date (Note) -
Published
status (Latency Note)
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Abstract
The present invention relates to a sintering device or diffusion soldering device for connecting components of at least one electronic assembly by means of pressure sintering, comprising an evacuatable process chamber in which an upper tool and a lower tool are arranged, between which the assembly is held and which are displaceable relative to one another in their distance apart to exert a press force, wherein the process chamber comprises a base body having on its upper side an access opening and a cover which is adjustable between a closed position in which the access opening is closed by the cover and an open position, wherein the upper tool is supported on the cover in the closed position of the cover at least during the exertion of the press force.

First Claim
Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
PINK GMBH THERMOSYSTEME | WERTHEIM GERMANY WETTER NORTH RHINE-WESTPHALIA |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Oetzel, Christoph | Freudenberg Boxtal, DE | 8 | 5 |
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