VAPOR CHAMBER WITH INTEGRATED BUBBLE PUMP
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United States of America Patent
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Issued Date -
Oct 3, 2024
app pub date -
Mar 21, 2024
filing date -
Mar 28, 2023
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Abstract
A vapor chamber for cooling a heat source is provided. The vapor chamber includes a cavity between a baseplate and a condenser wall, the cavity containing a cooling medium, wherein the baseplate has an evaporator side towards the cavity and an attachment side opposite to the evaporator side for attaching the heat source, wherein the baseplate is adapted for transferring heat from the attachment side to the cavity, such that cooling medium evaporates at the evaporator side and condenses at the condenser wall, and wherein the vapor chamber further includes a channel, which is at least partially connected to the baseplate, with an inlet below a liquid level of the cooling medium and an outlet above the liquid level and which provides a bubble pump for transporting the liquid medium from the inlet to the outlet.
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