CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
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United States of America Patent
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Issued Date -
Oct 3, 2024
app pub date -
Sep 6, 2023
filing date -
Mar 31, 2023
priority date (Note) -
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status (Latency Note)
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Abstract
A circuit board includes a first insulation layer, a circuit wire positioned on the first insulation layer, a second insulation layer covering the circuit wire and overlapping a portion of the circuit wire, and having a via hole including a first side wall and a second side wall having different tilt angles and extending in the thickness direction of the first insulation layer, a first seed layer covering the first side wall and the second side wall of the via hole, a second seed layer positioned in the via hole and covering the first seed layer, a third seed layer positioned on an upper surface of the second insulation layer and including the same material as the second seed layer, a first conductive layer positioned on the second seed layer, and a second conductive layer positioned on the third seed layer.
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