COMPOSITE PRINTED WIRING BOARD AND METHOD OF MANUFACTURING COMPOSITE PRINTED WIRING BOARD
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United States of America Patent
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Issued Date -
Oct 3, 2024
app pub date -
Sep 14, 2022
filing date -
Sep 17, 2021
priority date (Note) -
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status (Latency Note)
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Abstract
A composite printed wiring board includes a first printed wiring board, a second printed wiring board, an intermediate plate, a first bonding layer, and a second bonding layer. The intermediate plate is provided to surround a space. The first printed wiring board closes one side of the space and is bonded to the intermediate plate. The second printed wiring board closes the other side of the space and is bonded to the intermediate plate. At least any of the first printed wiring board and the second printed wiring board has a through hole. A cavity is provided that is the space surrounded by the first printed wiring board, the second printed wiring board, the intermediate plate, the first bonding layer, and the second bonding layer. The through hole in communication with the cavity.
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