HIGH FREQUENCY MODULE
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United States of America Patent
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Issued Date -
Oct 3, 2024
app pub date -
Mar 26, 2024
filing date -
Mar 30, 2023
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Abstract
A high frequency module includes: a first capacitor C1 having a first end connected to a first signal line; a second capacitor having a first end is connected to a second signal line; a first switch provided between a second end of the first capacitor and a reference potential; a second switch provided between a second end of the second capacitor and the reference potential; an inspection terminal allowing inspection of both the first switch and the second switch; and a resistor connected between a connection point between the first capacitor and the first switch.
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