ELECTRONIC STRUCTURE, MANUFACTURING METHOD OF ELECTRONIC STRUCTURE, AND MANUFACTURING METHOD OF ELECTRONIC DEVICE
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United States of America Patent
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Issued Date -
Oct 3, 2024
app pub date -
Jan 19, 2024
filing date -
Mar 27, 2023
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Abstract
A manufacturing method of an electronic structure includes forming a second sacrificial layer extending from a substrate to a function part of a layered substrate including the substrate, a first sacrificial layer formed on the substrate, and the function part formed on the first sacrificial layer. The manufacturing method further includes forming a cover layer extending from the substrate to the second sacrificial layer, and removing the first sacrificial layer and the second sacrificial layer.
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