Importance

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Abstract

In an embodiment a method includes providing a first carrier on which an electrical connection material or a flux material is arranged, providing a second carrier on which at least one optoelectronic component is arranged, positioning the first carrier relative to the second carrier such that the electrical connection material or the flux material is facing at least one electrical connection surface and is spaced from the at least one electrical connection surface, pulse irradiating the first carrier with laser light such that at least areas of the electrical connection material or the flux material are detached from the first carrier and fall onto the at least one electrical connection surface of the optoelectronic component, wherein the electrical connection material or the flux material is arranged in a structured manner on the first carrier, and wherein the first carrier is irradiated over a large area with the laser light in order to detach at least regions of the structured electrical connection material or the flux material from the first carrier.

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First Claim