PACKAGE ARCHITECTURES FOR DIFFERENTIATED ARTIFICIAL-REALITY TASK-SPECIFIC CHIPLETS
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United States of America Patent
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Oct 3, 2024
app pub date -
Mar 26, 2024
filing date -
Apr 3, 2023
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Abstract
An artificial-reality system including (1) an output device, (2) one or more real-world sensors, and (3) an integrated-circuit package including (A) a general-purpose system-on-chip having a first die-to-die interface and (B) a differentiated artificial-reality task-specific chiplet having a second die-to-die interface coupled to the first die-to-die interface of the general-purpose system-on-chip. The differentiated artificial-reality task-specific chiplet may be configured to generate an output by performing one or more differentiated artificial-reality processing tasks on one or more inputs derived from the one or more real-world sensors, and the general-purpose system-on-chip may be configured to present, via the output device, an artificial reality to a user based at least in part on the output of the differentiated artificial-reality task-specific chiplet. Various other apparatuses, systems, and methods are also disclosed.
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