PACKAGES WITH ELECTRICAL FUSES
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United States of America Patent
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Issued Date -
Oct 3, 2024
app pub date -
Jun 11, 2024
filing date -
Jul 30, 2021
priority date (Note) -
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Abstract
In examples, a package comprises a semiconductor die having a device side and a bond pad on the device side, a conductive terminal exposed to an exterior of the package, and an electrical fuse. The electrical fuse comprises a conductive ball coupled to the bond pad, and a bond wire coupled to the conductive terminal. The bond wire is stitch-bonded to the conductive ball.
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