CHIP STRUCTURE AND METHOD FOR FORMING THE SAME
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United States of America
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Issued Date -
Oct 3, 2024
app pub date -
Jun 12, 2024
filing date -
Jun 12, 2024
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Abstract
A chip structure is provided. The chip structure includes a substrate. The chip structure includes a first conductive line over the substrate. The chip structure includes an insulating layer over the substrate and the first conductive line. The chip structure includes a conductive pillar over the insulating layer. The chip structure includes a solder bump on the conductive pillar. The solder bump is in direct contact with the conductive pillar.
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