METHOD OF BONDING COLUMN TYPE DEPOSITS
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Oct 3, 2024
app pub date -
Mar 27, 2024
filing date -
Mar 28, 2023
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
The present disclosure relates to a method of bonding column type deposits to a substrate, and more specifically, to a method of bonding to a substrate column type deposits, which are formed in a column shape and connect the substrate and electrodes of a semiconductor chip so as to connect the semiconductor chip to the substrate. A method of bonding column type deposits to a substrate according to the present disclosure has the advantage of bonding the column type deposits having a high aspect ratio to accurate positions while being aligned vertically on the substrate.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully