MULTIDEVICE PACKAGE WITH RECESSED MOUNTING SURFACE
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United States of America Patent
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Issued Date -
Oct 3, 2024
app pub date -
Apr 3, 2023
filing date -
Apr 3, 2023
priority date (Note) -
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status (Latency Note)
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Abstract
A multidevice package includes upper and lower surfaces with the lower surface disposed beneath a first die forming part of the package. The lower surface includes a first a set of electrical contacts and a recessed region with a second set of electrical contacts configured to allow a second die to be coupled to the lower surface and electrically coupled to the first die via the second set of contacts. The recessed region is sufficiently recessed to allow the package to be coupled to a mounting surface such as a printed circuit board via the first set of contacts while the second die remains suspended above the mounting surface.
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