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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
UNIV TEXAS	TEXAS USA

International Classification(s)

• H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
• B81C:PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE M....
• G06F:ELECTRIC DIGITAL DATA PROCESSING

• [Classification Symbol]

• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Abed, Ovadia	Austin, US	19	163
Ajay, Paras	Austin, US	27	36
Cullinan, Michael	Austin, US	8	12
Dunn, Lawrence	Austin, US	9	55
Goyal, Vipul	Austin, US	5	80
McDermott, Mark	Austin, US	12	13
Sayal, Aseem	Austin, US	12	10
Singhal, Shrawan	Austin, US	26	264
Sreenivasan, Sidlgata V	Austin, US	214	5594

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
3.5 Year Payment	$1600.00	$800.00	$400.00	Apr 3, 2028
7.5 Year Payment	$3600.00	$1800.00	$900.00	Apr 3, 2032
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Apr 3, 2036

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 3.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge - 7.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

Full Text

US Patent Application No: 2024/0332,056

HETEROGENEOUS INTEGRATION OF COMPONENTS ONTO COMPACT DEVICES USING MOIRÉ BASED METROLOGY AND VACUUM BASED PICK-AND-PLACE

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