SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM
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United States of America Patent
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Issued Date -
Oct 3, 2024
app pub date -
Nov 15, 2022
filing date -
Nov 29, 2021
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Abstract
A substrate processing method of processing a substrate includes: grinding a first surface of the substrate; and grinding, after grinding the first surface, a second surface of the substrate opposite to the first surface. A first grinding mark extending from a center of the first surface toward an outer periphery thereof in a gently curved manner is formed when the first surface is ground, a second grinding mark extending from a center of the second surface toward an outer periphery thereof in a gently curved manner is formed when the second surface is ground, and a curving direction of the first grinding mark and a curving direction of the second grinding mark are opposite when viewed through from one of the first surface or the second surface.
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