SILVER PATTERNING AND INTERCONNECT PROCESSES
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United States of America Patent
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Issued Date -
Oct 3, 2024
app pub date -
Jun 10, 2024
filing date -
Feb 27, 2020
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Abstract
A method for forming a semiconductor structure is provided. The method includes depositing a hard mask layer over a substrate. The method further includes depositing a silver precursor layer over the hard mask layer. The method further includes exposing portions of the silver precursor layer to a radiation, the radiation causing a reduction of silver ions in the irradiated portions of the silver precursor layer. The method further includes removing non-irradiated portions of the silver precursor layer, resulting in a plurality of silver seed structures.
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