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United States of America Patent
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Issued Date -
Oct 3, 2024
app pub date -
Jun 12, 2024
filing date -
May 13, 2016
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Abstract
A semiconductor substrate includes: a substrate; a first conductive line extending along a first direction; a semiconductor layer, wherein the first conductive line includes a first part overlapping with the semiconductor layer and a second part not overlapping with the semiconductor layer, the first part of the first conductive line has a first width along a second direction different from the first direction, the second part of conductive line has a second width along the second direction, and the first width is greater than the second width; and an electrode disposed on the semiconductor layer and including an arc edge outside the first conductive line, wherein the semiconductor layer includes a first part extending along the second direction and overlapping with the arc edge and a second part connecting the first part and overlapping with a side of the first part of the first conductive line.
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