SENSOR MODULE
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United States of America
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Issued Date -
Oct 3, 2024
app pub date -
Mar 20, 2024
filing date -
Mar 20, 2024
priority date (Note) -
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Abstract
Provided is a sensor module including a box-shaped structure that includes a bottom surface portion and a side surface portion arranged upright with respect to the bottom surface portion, a sensor unit that is mounted on the bottom surface portion of the box-shaped structure and that includes a pressure sensor body, and a cover member that is placed on the side surface portion in such a manner as to cover the sensor unit, in which an opening for allowing communication between a space inside the box-shaped structure housing the sensor unit and outside is formed on the side surface portion in the box-shaped structure.
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