METHOD FOR MEASURING SURFACE PARAMETER OF COPPER FOIL, METHOD FOR SORTING COPPER FOIL, AND METHOD FOR PRODUCING SURFACETREATED COPPER FOIL
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United States of America Patent
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Oct 3, 2024
app pub date -
Dec 22, 2021
filing date -
Dec 22, 2021
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Abstract
A method for measuring a surface parameter of copper foil exhibiting high correlation with high frequency characteristics, the method for measuring a surface parameter of copper foil including: (a) acquiring a surface profile on at least one surface of an untreated copper foil; (b) setting a cutoff value for an L filter based on the surface profile; (c) acquiring a surface profile on at least one surface of surface-treated copper foil originating from the untreated copper foil; (d) subjecting the surface profile of the surface-treated copper foil to filter processing, the filter processing including processing using an L filter with the cutoff value; and (e) calculating at least one of surface parameters defined by ISO25178 on the surface of the surface-treated copper foil based on the surface profile after the filter processing.
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