Method for Synthesizing High-Entropy Alloy (HEA) Nanostructures
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Oct 3, 2024
app pub date -
Mar 27, 2024
filing date -
Mar 29, 2023
priority date (Note) -
Published
status (Latency Note)
![]() |
A preliminary load of PAIR data current through [] has been loaded. Any more recent PAIR data will be loaded within twenty-four hours. |
PAIR data current through []
A preliminary load of cached data will be loaded soon.
Any more recent PAIR data will be loaded within twenty-four hours.
![]() |
Next PAIR Update Scheduled on [ ] |

Importance

US Family Size
|
Non-US Coverage
|
Abstract
A method for synthesizing high-entropy alloy (HEA) nanostructures, each having a HEA shell uniformly grown on a nanocore, is provided. The method comprises: mixing nanostructure seeds, a plurality of metal precursors, one or more reducing agents and a surfactant in a solvent to form a first mixture; subjecting the first mixture to ultrasonication under an ultrasonication temperature; degassing the first mixture upon heating at a degassing temperature under vacuum with magnetic stirring; purging the first mixture with an inert gas; and keeping the first mixture at a growth temperature for a growth time to form the HEA nanostructures. The provided method is a low-temperature, facile, general, wet-chemical, seeded epitaxial growth method which can synthesize a library of unconventional-phase HEA nanostructures, e.g., 4H-Au@HEA nanowires and 2H/fcc-Au@HEA nanosheets with 5-10 components by using 4H-Au NWs and 2H/fcc-Au NSs as seeds respectively.
First Claim
all claims..Other Claims data not available
Family
Country | kind | publication No. | Filing Date | Type | Sub-Type |
---|---|---|---|---|---|
CN | A | CN118720125 | Mar 27, 2024 | Patent | Application |
Type : Patent Sub-Type : Application | |||||
UNEXAMINED APPLICATION FOR A PATENT FOR INV. | Method for synthesizing high-entropy alloy nanostructure and high-entropy alloy nanostructure synthesized by same | Oct 01, 2024 |
- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
CITY UNIVERSITY OF HONG KONG | 83 TAT CHEE AVENUE KOWLOON HONG KONG |
International Classification(s)

- 2024 Application Filing Year
- C25B Class
- 401 Applications Filed
- 23 Patents Issued To-Date
- 5.74 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
LI, Zijian | Hong Kong, HK | 16 | 7 |
# of filed Patents : 16 Total Citations : 7 | |||
ZHAI, Li | Hong Kong, HK | 14 | 10 |
# of filed Patents : 14 Total Citations : 10 | |||
ZHANG, An | Hong Kong, HK | 65 | 211 |
# of filed Patents : 65 Total Citations : 211 | |||
ZHANG, Hua | Hong Kong, HK | 534 | 3218 |
# of filed Patents : 534 Total Citations : 3218 |
Cited Art Landscape
- No Cited Art to Display

Patent Citation Ranking
- 0 Citation Count
- C25B Class
- 0 % this patent is cited more than
- 1 Age
Forward Cite Landscape
- No Forward Cites to Display

Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
---|---|---|---|---|
3.5 Year Payment | $1600.00 | $800.00 | $400.00 | Apr 3, 2028 |
7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Apr 3, 2032 |
11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Apr 3, 2036 |
Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge - 3.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge - 7.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
Full Text

Legal Events
- No Legal Status data available.

Matter Detail

Renewals Detail
