EXPANDABLE ONE-COMPONENT THERMOSETTING EPOXY ADHESIVE WITH IMPROVED ADHESION
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United States of America Patent
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Oct 3, 2024
app pub date -
Sep 6, 2022
filing date -
Sep 8, 2021
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A one-component thermosetting epoxy resin adhesive, including heat-expandable microspheres with an expansion-initiation temperature (Ts) between 90° C.-115° C. and a mean particle size D (0.5) between 30-75 μm, at least at least one toughness improver and a viscosity of 500 to 5000 Pas at 25° C. The room temperature pumpable expandable adhesives have good adhesion on metal substrates, sufficient expansion rates and a closed surface of the cured foamed material.
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