Molding Material

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United States of America Patent

APP PUB NO 20240327623A1
SERIAL NO

18617958

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The molding material of the present disclosure includes a cellulose fiber and a specific cellulose derivative in which a part of the hydrogen atoms constituting the hydroxy groups of cellulose is substituted with a chemical structure represented by the following formula (1) or (3) and another part of the hydrogen atoms is substituted with a chemical structure represented by the following formula (2) or (4), wherein the content of the cellulose fiber is 50 mass % or more and 70 mass % or less.

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Patent Owner(s)

Patent OwnerAddress
SEIKO EPSON CORPORATION1-6 SHINJUKU 4-CHOME SHINJUKU-KU TOKYO 160-8801

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
ASAI, Shintaro Matsumoto, JP 13 4
HOKARI, Hirofumi Chino, JP 23 141
YAMADA, Atsushi Chino, JP 406 3161
YOKOKAWA, Shinobu Okaya, JP 46 87

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