Low Temperature Curable One Component Epoxy Compositions containing Resin-Blocked Urea Curatives

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United States of America Patent

APP PUB NO 20240327567A1
SERIAL NO

18129605

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Abstract

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The present disclosure provides for latent curing accelerators as well as compositions containing such a latent curing accelerator with a substance to be cured (e.g., an epoxy resin). The latent curing accelerators comprise a urea compound and an encapsulant system having a polyphenol resin and/or at least one additional excipient. Methods of making and use are further provided.

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EVONIK OPERATIONS GMBH45128 ESSEN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fazel, Shafiq Allentown, US 9 3
Hartmann, John Medford, US 9 19
La, Comare Douglas M Northampton, US 5 3
Lal, Gauri Sankar Whitehall, US 56 884
Roumpelakis, Emmanouil Recklinghausen, DE 5 0

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